Conference Organizing Committee


Valeriy Sukharev is a Technical Lead with the Design to Silicon Division (Calibre), Mentor, a Siemens Business, Fremont, CA, USA. He has received the Engineer-Physicist Diploma degree in microelectronics from the National Research University of Electronic Technology (MIET), Moscow, Russia and Ph.D. degree in Physical Chemistry from the Russian Academy of Sciences. Prior to Mentor Graphics, Dr. Sukharev was a Chief Scientist with Ponte Solutions, Inc., a Visiting Professor with Brown University, and a Guest Researcher with NIST, Gaithersburg, MD. He also held senior technical positions with LSI Logic Advanced Development Lab. 

Dr. Sukharev was a recipient of the Best Paper Award from the International Conference on Computer-Aided Design (ICCAD) and the 2016 & 2018 Mahboob Khan Outstanding Industry Liaison/Associate Awards (SRC). His current research interests include development of new full-chip modeling and simulation capabilities for the electronic design automation, semiconductor processing and reliability management. He serves on the editorial boards and technical/steering committees of a number of profiling journals and conferences.

Conference Chair



Prof. Dr. Ehrenfried Zschech is Department Head for Microelectronic Materials and Nanoanalysis at the Fraunhofer Institute IKTS in Dresden, Germany, which he joined in 2009. His responsibilities include multi-scale materials characterization and reliability engineering. Ehrenfried Zschech received his Dr. rer. nat. degree from Technische Universität Dresden. He managed the Materials Analysis Department at Advanced Micro Devices in Dresden from 1997 to 2009. Ehrenfried Zschech holds an adjunct professorship at Faculty of Chemistry of Warsaw University, Poland, as well as honorary professorships for Nanomaterials at Brandenburg University of Technology Cottbus and for Nanoanalysis at Technische Universität Dresden. Ehrenfried Zschech is Member of the Board of Directors of the Materials Research Society (MRS).

Vice Chair



Arief Suriadi Budiman received his B.S. in mechanical engineering from Institute of Technology, Bandung (ITB), Indonesia, his M.EngSc in materials engineering from Monash Univ., Australia and his Ph.D. in Materials Science and Engineering from Stanford University, CA in 2008. During his doctoral candidacy at Stanford’s Department of Materials Science & Engineering under the supervision of Professor William D. Nix (MRS Von Hippel Award 2007), Dr. Budiman received several research awards (MRS Graduate Silver Award 2006, MRS Best Paper 2006) and contributed to several high-impact journal publications (Acta Materialia, Applied Physics Letters, Journal of Electronic Materials). As a graduate student, he gave two symposium invited talks as well in the MRS spring and fall meetings in 2006. More recently Dr. Budiman has been awarded the prestigious Los Alamos National Laboratory (LANL) Director's Research Fellowship to conduct top strategic research for the energy and national security missions of the Los Alamos National Laboratory's. At the Center for Integrated Nanotechnologies (CINT) at Los Alamos, Dr. Budiman’s research program involves nanomaterials for extreme environments with potential applications in advanced energy systems including for next generation nuclear power reactors.

Currently, at the Singapore University of Technology & Design (SUTD), Dr. Budiman is leading a dynamic, young group researching nanomaterials and nanomechanics and their implications for extending the extreme limits of materials as well as their applications in the next generation energy technologies (solar PV, extreme environments, energy storage, etc.). His work has also recently received the famed Berkeley Lab Scientific Highlights twice in May 2010 and June 2013 (the latter was for his novel, innovative characterization technique that enables thin silicon solar PV technology). He has had extensive industrial exposures through his work as well as consulting with some of the biggest names in Silicon Valley and in Solar PV R&D (research and development) areas – amongst others, San Jose-based SunPower Corporation and Stanford-based Bay Area Photovoltaics Consortium (BAPVC), in addition to national energy labs /academic research experiences (Berkeley Lab, Los Alamos National Lab, etc.). He also recently served an academic stint at MIT (Massachusetts Institute of Technology) in Boston, MA, as part of faculty immersion/training exchange to conduct research in energy (Solar PV, as well as next generation energy storage/Li-ion). In SUTD in Singapore, he is currently running a multi-million dollars research grant program on Solar PV and more particularly on enabling ultra thin (< 80 micron) silicon solar cells sponsored by the National Research Foundation (NRF) of the Singapore’s Government. He has been invited to give invited lectures/seminars on his research program in various top international scientific/technological conferences (International Plasticity, MRS, TMS, EU PVSEC, PVDAYS, ICMAT, etc.). Dr. Budiman has authored/co-authored several high-impact journal publications (Acta Materialia, Solar Energy Materials & Solar Cells, Progress in Photovoltaics, Materials Science Engineering A, Materials, etc.). He has also recently published a book “Probing Crystal Plasticity at the Nanoscales – Synchrotron X-ray Microdiffraction” (Springer 2015). He has two U. S. Patents and one pending.

Past Chair



Prof. Reinhold H. Dauskardt is the Ruth G. and William K. Bowes Professor in Materials Science and Engineering, Mechanical Engineering and Surgery at Stanford University. He and his lab have worked extensively on integrating new materials into emerging nanoscience and energy technologies and also on the barrier and biomechanical function of human skin and other soft tissues. He has pioneered quantitative methods for adhesion and cohesion characterization. He was awarded the prestigious Semiconductor Industry Association University Researcher Award in 2010 for “research which has provided substantive and sustained contributions to semiconductor industry science and technology."



Dusan Petronivic PhD. is an Interconnect Modeling Technologist with Design to Silicon group at Mentor Graphics, now part of Siemens,  working on all aspects of parasitic extraction. Dusan received his BS from University of Belgrade, an MS from the Worcester Polytechnic Institute, and a Ph.D. from University of Montenegro, where he was also employed as a professor and served as chairman of EE department. Dusan spent six years teaching at Harvey Mudd College before joining  LSI Logic Advanced Development Laboratory as a member of technical staff working on the interconnect modeling. He also has worked as a consultant for NASA and NOVA Management Inc. He holds fifteen US patents and has published numerous journal and conference papers. He received “Engineer of the Year”  3DInCites Award for Excellence in Heterogeneous Integration Technologies.



Dr. Hiu Yung Wong is an Assistant Professor in the EE department of San José State University since 2018. He has published more than 50 papers and patents. His research interests include NBTI and hot carrier degradation simulation in FinFET/nanowire/nanosheet and wide band gap material device (GaN, SiC, Ga2O3 and Diamond) optimization and simulation, novel semiconductor device design/simulation and Design Technology Co-Optimization (DTCO). From 2009 to 2018, he was a TCAD Senior Staff Application Engineer with Synopsys, Inc. From 2006 to 2009, he was an integration engineer of 45nm/32nm NOR flash memory in Spansion. He obtained his PhD in EECS from the University of California, Berkeley in 2006.




Dr. Xiaopeng Xu is leading a Synopsys task force that focuses on providing strategic support for key TCAD users to model new stress behaviors and to develop usage models and applications in advanced technologies and materials. He has more than 20 years of experience in developing technology modeling tools and applications and worked as senior R&D manager, product manager, senior R&D engineer since he joined Synopsys in 2002. Previously he held various R&D positions at Avant!, Hyundai Electronics of America and IBM, and conducted research at University of California and Stanford University, after receiving his engineering Ph.D. degree from Brown University in 1994. He has over 70 technical publications/patents that received over 4000 citations. He presently serves in the technical committees for IEEE International Interconnect Technology Conference and IRSP.





Conference Manager


Technical Program Committee/Advisory Board

  • Prof. Paul S. Ho, UT Austin

  • Prof. Dr. Ehrenfried Zschech, Fraunhofer Institute for Ceramic Technologies and Systems IKTS

  • Prof. Oliver Thomas, Aix-Marseille Universite

  • Prof. Reinhold Dauskardt, Stanford University

  • Prof. Carl V. Thompson, MIT

  • Prof. Farid N. Najm, University of Toronto

  • Dr. Robert Rosenberg, IBM

  • Dr. Antony Oates, TSMC

  • Dr. Xiaopeng Xu, Synopsys

  • Prof. Arief Budiman, Singapore University of Technology and Design

  • Dr. C.-K. Hu, IBM

  • Dr. Martin Gall, GLOBALFOUNDRIES

  • Dr. Jon Molina, IMDEA Materiales

  • Prof. Dr. Alex Dommann, EMPA - Swiss Federal Laboratories for Material Science and Technology

  • Dr. Valeriy Sukharev, Mentor, a Siemens Business

  • Dr. Shinichi Ogawa, AIST